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US 11,691,226 B2Granted
Lead-free solder alloy, solder joining material, electronic circuit mounting substrate, and electronic control device
AssigneeTamura Corporation
InventorsYurika Munekawa, Takeshi Nakano, Masaya Arai, Takanori Shimazaki, Tsukasa Katsuyama
Life of this patent
Estimating the term…
Abstract
A lead-free solder alloy includes 2.0% by mass or more and 4.0% by mass or less of Ag, 0.3% by mass or more and 0.7% by mass or less of Cu, 1.2% by mass or more and 2.0% by mass or less of Bi, 0.5% by mass or more and 2.1% by mass or less of In, 3.0% by mass or more and 4.0% by mass or less of Sb, 0.001% by mass or more and 0.05% by mass or less of Ni, 0.001% by mass or more and 0.01% by mass or less of Co, and the balance being Sn.
Claims7
A lead-free solder alloy for an on-vehicle electronic circuit mounting substrate comprising:
- 2.0% by mass or more and 4.0% by mass or less of Ag;
- 0.3% by mass or more and 0.7% by mass or less of Cu;
- 1.7% by mass or more and 2.0% by mass or less of Bi;
- 0.5% by mass or more and 2.1% by mass or less of In;
- 3.0% by mass or more and 4.0% by mass or less of Sb;
- 0.001% by mass or more and 0.05% by mass or less of Ni;
- 0.001% by mass or more and 0.01% by mass or less of Co;
- optionally further comprising at least one of P, Ga, and Ge in a total amount of 0.001% by mass or more and 0.05% by mass or less;
- optionally further comprising at least one of Fe, Mn, Cr, and Mo in a total amount of 0.001% by mass or more and 0.05% by mass or less;
- and
- the balance being Sn.
8 more elements
A lead-free solder alloy comprising:
- 2.0% by mass or more and 4.0% by mass or less of Ag;
- 0.3% by mass or more and 0.5% by mass or less of Cu;
- 1.2% by mass or more and 2.0% by mass or less of Bi;
- 0.5% by mass or more and 2.1% by mass or less of In;
- 3.0% by mass or more and 4.0% by mass or less of Sb;
- 0.001% by mass or more and 0.05% by mass or less of Ni;
- 0.001% by mass or more and 0.01% by mass or less of Co;
- optionally further comprising at least one of P, Ga, and Ge in a total amount of 0.001% by mass or more and 0.05% by mass or less;
- optionally further comprising at least one of Fe, Mn, Cr, and Mo in a total amount of 0.001% by mass or more and 0.05% by mass or less;
- and
- the balance being Sn.
8 more elements
Dependencies are inferred from the claim text.