Configurable fixture for cutting shapes

An apparatus for cutting a wafer into one or more shapes, the apparatus comprising:

• a fixture including a first floor, wherein the first floor includes an array of pin holes;
• a plurality of pins coupled in the first floor, the plurality of pins comprising:
• long pins that are held in a first set of pin holes in the array of pin holes of the first floor,
• medium pins that are shorter than the long pins and held in a second set of pin holes in the array of pin holes of the first floor, and
• short pins that are shorter than the medium pins and held in a third set of pin holes in the array of pin holes of the first floor;
• and
• an inlay that rests on the short pins of the plurality of pins, wherein the inlay includes holes that receive the medium pins of the plurality of pins to stabilize the inlay from moving in a direction parallel to the first floor,
• wherein the long pins are configured such that the wafer contacts and rests on the long pins and the short pins are configured such that the inlay contacts and rests on the short pins while a laser cuts, from the wafer, a shape that corresponds to the inlay, and such that the cut portion of the wafer rests on the inlay.