Integrated ceiling device with mechanical arrangement for a light source

An integrated ceiling device comprising:

• a heat dissipating structure formed as a toroid and including at least two heat dissipating fins that extend upward from a top face of the heat dissipating structure and radially outward from a central vertical axis of the heat dissipating structure:
• a protective frame positioned at a perimeter of a bottom face of the heat dissipating structure, the protective frame having a ring shape;
• an electronic device housing formed as a cylinder, the electronic device housing being located within the toroid of the heat dissipating structure and being connected to an inner circumference of the toroid of the heat dissipating structure via at least two support arms, the cylinder of the electronic device housing extending above the heat dissipating structure and having a central vertical axis that is substantially vertically aligned with the central vertical axis of the heat dissipating structure, the electronic device housing including an internal space that hosts therein a power supply for a first light source that is coupled to the bottom face of the heat dissipating structure and oriented to emit light toward a room below;
• the first light source;
• and
• an optical assembly that is coupled to the protective frame in a position arranged to guide the light emitted from the first light source,
• wherein at least one through air opening is located between the cylinder of the electronic device housing and the toroid of the heat dissipating structure,
• wherein the electronic device housing comprises:
• a top cap,
• a mounting structure for the integrated ceiling device and that provides access to the internal space of the electronic device housing, and
• at least one protrusion from an exterior wall of the housing, the at least one protrusion configured to dissipate heat generated by the power supply, and
• wherein the electronic device housing, the heat dissipating structure, the protective frame and the at least one through air opening are arranged such that, upon energizing the first light source and a temperature of the heat dissipating structure increasing above an ambient temperature, ambient temperature air from below the integrated ceiling device is induced to flow upward through the at least one through air opening between the toroid of the heat dissipating structure and the cylinder of the electronic device housing.