Semiconductor device and manufacturing method thereof
AssigneeJapan Display Inc.
InventorNobuto Managaki
Life of this patent
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Abstract
A semiconductor device includes: a resin substrate; a display element configured to generate an image; and a circuit layer including a thin film transistor configured to control the display element. The resin substrate has a main body made of resin and a surface layer made of the resin laminated on the main body. The surface layer has a lower electrification property than the main body or the surface layer has a lower film density than the main body. Each of the display element and the circuit layer is on the surface layer.
Claims15
A semiconductor device comprising:
- a resin substrate;
- a display element configured to generate an image;
- and
- a circuit layer including a thin film transistor configured to control the display element,
- wherein the resin substrate has a main body made of resin and a surface layer made of the resin laminated on the main body,
- the surface layer has a lower electrification property than the main body or the surface layer has a lower film density than the main body,
- each of the display element and the circuit layer is on the surface layer,
- the main body is made of polyimide containing pyromellitic anhydride, and
- the surface layer is made of polyimide containing diphenylene.
A method of manufacturing the semiconductor device, the method comprising:
- forming a resin substrate with a main body and a surface layer laminated on each other, through applying and baking a resin, the surface layer having a lower electrification property or a lower film density than the main body;
- forming a circuit layer including a thin film transistor on a surface of the surface layer of the resin substrate;
- and
- forming a display layer on the circuit layer, the display layer including a display element configured to generate an image, wherein
- the main body is formed of polyimide containing pyromellitic anhydride, and the surface layer is formed of polyimide containing diphenylene.
Dependencies are inferred from the claim text.