Method of fabricating display device

A method of fabricating a display device, the method comprising:

• forming a dielectric layer on an encapsulation layer of a display panel, the encapsulation layer including a first encapsulation region and a second encapsulation region adjacent to the first encapsulation region;
• forming a conductive layer on the dielectric layer;
• forming a first photoresist layer on the conductive layer that overlaps each of the first encapsulation region and the second encapsulation region;
• forming a second photoresist layer on the first photoresist layer that overlaps the second encapsulation region;
• and
• etching the conductive layer based on the first photoresist layer and the second photoresist layer,
• wherein the display panel includes a display region for displaying image and a peripheral region surrounding the display region, and the first encapsulation region and the second encapsulation region are defined within the display region,
• wherein the second encapsulation region is disposed between the first encapsulation region and the peripheral region when viewed in a plan,
• wherein, when viewed in a thickness direction of the display panel, at least a portion of the encapsulation layer that overlaps the second encapsulation region has a thickness greater than a thickness of the encapsulation layer that overlaps the first encapsulation region.