US 11,690,243 B2Granted

Light-emitting device

AssigneeSemiconductor Energy Laboratory Co., Ltd.

InventorsMasataka Nakada, Takayuki Abe, Naoyuki Senda

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Abstract

A flexible device with fewer defects caused by a crack is provided. A flexible device with high productivity is also provided. Furthermore, a flexible device with less display failure even in a high temperature and high humidity environment is provided. A light-emitting device includes a first flexible substrate, a second flexible substrate, a buffer layer, a first crack inhibiting layer, and a light-emitting element. A first surface of the first flexible substrate faces a second surface of the second flexible substrate. The buffer layer and the first crack inhibiting layer are provided over the first surface of the first flexible substrate. The buffer layer overlaps with the first crack inhibiting layer. The light-emitting element is provided over the second surface of the second flexible substrate.

Claims4

Dependent claims

A display device comprising:

a first layer having flexibility;
a display unit over the first layer, the display unit comprising a light-emitting element;
a driver circuit over the first layer;
an external connection terminal over the first layer;
a sealing layer over the display unit and the driver circuit;
a cover layer over the sealing layer;
a conductive layer over the cover layer;
and
a second layer having flexibility over the conductive layer,
wherein the light-emitting element comprises a light-emitting layer between a pair of electrodes,
wherein the sealing layer fills a space over the light-emitting element, a space over the driver circuit, and a space between the first layer and the conductive layer, and
wherein, in a plan view, the conductive layer is provided so as to surround the display unit, the driver circuit and an electrode, in which the electrode forms an outermost surface of the external connection terminal.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/067,148Filed 9 Oct 2020 · continuation
Priority: JP 2014-0437426 Mar 2014
Published: US 2021/0028392 A128 Jan 2021
Granted: 27 Jun 2023
Term ends: Not estimatedThe source records don’t support an estimate.

Classification11 codes

H10K 77/111
Substrates, e.g. flexible substrates: flexible substrates
H10K 59/871
Passivation; Containers; Encapsulations: self-supporting sealing arrangements
H10K 59/8721
Self-supporting sealing arrangements: metallic sealing arrangements
H10K 59/8722
Self-supporting sealing arrangements: peripheral sealing arrangements, e.g. adhesives, sealants

Family

Application14/632,115Parent of this continuation · filed 26 Feb 2015
Application15/890,399Parent of this continuation · filed 7 Feb 2018
US 9,899,626 B2Parent of this continuation · filed 20 Feb 2018
US 10,804,487 B2Parent of this continuation · filed 13 Oct 2020
US 2021/0028392 A1Pre-grant publication · published 28 Jan 2021
US 2015/0255740 A1Published application
US 2018/0175322 A1Published application
US 11,690,243 B2This patent

From the US filing history. Foreign family members aren’t listed.