Power semiconductor cooling system
AssigneeABB Schweiz AG
InventorsThomas Kendzia, III, Christopher Alan Belcastro, Taylor Miller
Life of this patent
Estimating the term…
Abstract
A cooling system for power semiconductor switches is provided. The cooling system includes a heat sink that is pressed against the power semiconductor switch. A plenum is also provided with an opening through a wall thereof which is aligned with the heat sink. A fan draws air through or around the heat sink and through the plenum wall opening and the plenum in order to cool the power semiconductor switch.
Claims17
A cooling system for a power semiconductor switch, comprising:
- a heat sink pressed against the power semiconductor switch;
- a plenum comprising a plenum wall with a first opening therethrough, the heatsink being aligned with the first opening;
- and
- a fan in communication with the plenum,
- wherein the fan is configured to:
- flow cooling air through or around the heat sink,
- flow the cooling air through the first opening in the plenum wall and through the plenum, and
- flow the cooling air out of or into the plenum,
- wherein the heat sink comprises a first channel extending therethrough,
- wherein the first channel being aligned with the first opening in the plenum wall, and
- wherein the first channel is enclosed around a circumference thereof.
A cooling system for a power semiconductor switch, comprising:
- a heat sink pressed against the power semiconductor switch;
- a plenum comprising a plenum wall with a first opening therethrough, the heatsink being aligned with the first opening;
- and
- a fan in communication with the plenum,
- wherein the fan is configured to:
- flow cooling air through or around the heat sink,
- flow the cooling air through the first opening in the plenum wall and through the plenum, and
- flow the cooling air out of or into the plenum,
- wherein the power semiconductor switch is pressed between two of the heat sink, the power semiconductor switch being smaller in width than each of the two heat sinks such that a second channel is formed between the two heat sinks and the power semiconductor switch, and further comprising a second opening through the plenum wall aligned with the power semiconductor switch.
A cooling system for a power semiconductor switch, comprising:
- a heat sink pressed against the power semiconductor switch;
- a plenum comprising a plenum wall with a first opening therethrough, the heatsink being aligned with the first opening;
- a fan in communication with the plenum,
- wherein the fan is configured to:
- flow cooling air through or around the heat sink,
- flow the cooling air through the first opening in the plenum wall and through the plenum, and
- flow the cooling air out of or into the plenum;
- and
- three of the heat sink and two of the power semiconductor switch, each of the power semiconductor switches being pressed between two of the heat sinks such that one heat sink is pressed between the two power semiconductor switches and two of the heat sinks are each pressed against an outer side of a respective one of the two power semiconductor switches.
A cooling system for a power semiconductor switch, comprising:
- a heat sink pressed against the power semiconductor switch;
- a plenum comprising a plenum wall with a first opening therethrough, the heatsink being aligned with the first opening;
- and
- a fan in communication with the plenum,
- wherein the fan is configured to:
- flow cooling air through or around the heat sink,
- flow the cooling air through the first opening in the plenum wall and through the plenum, and
- flow the cooling air out of or into the plenum;
- and
- an electrical connector electrically coupled to the power semiconductor switch extending through the plenum wall, the plenum and a back wall of the plenum.
Dependencies are inferred from the claim text.