Manufacturing method of carrier structure

A manufacturing method of a carrier structure, comprising:

• providing a carrier comprising a first surface, a second surface opposite to the first surface, and at least one through hole penetrating the carrier;
• and
• forming a build-up circuit layer on the carrier, wherein the build-up circuit layer comprises:
• at least one first circuit layer located on the first surface of the carrier and comprising at least one first pad, wherein the at least one first pad is disposed relative to the at least one through hole;
• at least one first dielectric layer located on the at least one first circuit layer;
• a second circuit layer located on the at least one first dielectric layer and comprising at least one second pad;
• a second dielectric layer located on the second circuit layer and comprising at least one opening, wherein the at least one opening exposes the at least one second pad;
• and
• a plurality of conductive vias penetrating the at least one first dielectric layer and electrically connected to the at least one first circuit layer and the second circuit layer,
• wherein before forming the build-up circuit layer on the carrier, the method further comprises:
• forming a connecting layer between the carrier and the build-up circuit layer, so that the connecting layer covers the at least one through hole.