Substrate connection member comprising substrate having opening part, which encompasses region in which through wire is formed, and conductive member formed on side surface of opening part, and electronic device comprising same

An electronic device, comprising:

• a first circuit board on which a first communication circuit is disposed;
• a second circuit board on which a second communication circuit is disposed;
• and
• a substrate connection member with multiple layers stacked on each other, the substrate connection member including a front surface corresponding to the first circuit board and a rear surface corresponding to the second circuit board,
• wherein the substrate connection member comprises:
• a first opening extending from the front surface to the rear surface, the first opening comprising a first conductive member coated on an inner surface of the first opening;
• a second opening extending from the front surface to the rear surface, the second opening comprising a second conductive member coated on an inner surface of the second opening, the first opening and the second opening encompassing a partial region of the substrate connection member;
• a first conductive bridge connecting the first conductive member with the second conductive member based on a first end of the first opening and a first end of the second opening;
• a second conductive bridge connecting the first conductive member with the second conductive member based on a second end of the first opening and a second end of the second opening;
• and
• at least one through-wire extending from the front surface to the rear surface in the partial region,
• wherein the first opening and the second opening are separate from one another,
• wherein the first communication circuit and the second communication circuit are electrically connected to each other through the at least one through-wire,
• wherein the first conductive bridge and the second conductive bridge are entirely disposed between the first opening and the second opening in an inner space between the front surface and the rear surface of the PCB, and
• wherein the first conductive bridge and the second conductive bridge are disposed in the same layer among the multiple layers of the PCB.