Circuit board structure

A circuit board structure, comprising:

• a dielectric substrate comprising a top surface and a bottom surface opposite to the top surface and comprising at least one through cavity penetrating the dielectric substrate;
• at least one embedded block fixed in the at least one through cavity, comprising a top surface and a bottom surface opposite to the top surface, and comprising at least one first through hole and at least one second through hole;
• at least one electronic component disposed in the at least one first through hole of the at least one embedded block;
• at least one first build-up circuit layer disposed on the top surface of the dielectric substrate and covering the at least one embedded block;
• at least one second build-up circuit layer disposed on the bottom surface of the dielectric substrate and covering the at least one embedded block;
• and at least one conductive through via disposed in the second through hole of the at least one embedded block, wherein the at least one conductive through via contacts and is directly electrically connected to the at least one first build-up circuit layer and the at least one second build-up circuit layer;
• wherein the at least one embedded block comprises conductive materials, the conductive materials comprise a metal, an alloy, or a metal mixed with a non-metallic material, and the non-metallic material comprises diamond or graphene.