Loading patent…
AssigneeBio-Rad Laboratories, Inc.
InventorsAmir Sadri, Neven Nikolic, Gabriel Culinco, Thanh-Vi Tran, Nenad Kircanski
Estimating the term…
A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.
A thermal management assembly comprising:
A method of thermally cooling a heat pump system, the methods comprising:
A method of thermally cooling a heat pump system, the methods comprising:
Dependencies are inferred from the claim text.