Printed circuit board and electronic device including same
AssigneeSamsung Electronics Co., Ltd.
InventorsEunseok Hong, Gyounghwan Park, Cheolyoon Chung
Life of this patent
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Abstract
According to various embodiments, a printed circuit board may include: a first wiring layer including at least one first signal line and at least one first dummy line; and a second wiring layer arranged on the first wiring layer and including at least one second signal line and at least one second dummy line, wherein when the printed circuit board is viewed from above, the at least one first signal line may be arranged to overlap, at least in part, the at least one second dummy line, and the at least one second signal line may be arranged to overlap, at least in part, the at least one first dummy line.
Claims19
A printed circuit board comprising:
- a first wiring layer comprising a plurality of first signal lines and a plurality of first dummy lines;
- and a second wiring layer arranged on the first wiring layer and comprising a plurality of second signal lines and a plurality of second dummy lines, wherein when the printed circuit board is viewed from above, each of the plurality of first signal lines is arranged to overlap, at least in part, one of the plurality of second dummy lines, and the plurality of second signal lines is arranged to overlap, at least in part, one of the plurality of first dummy lines, and wherein the printed circuit board is configured to provide a plurality of 3-phase interfaces by combining one of the plurality of first signal lines with two of the plurality of second signal lines adjacent thereto to form a first 3-phase interface and combining one of the plurality of second signal lines with two of the plurality of first signal lines adjacent thereto to form a second 3-phase interface, and wherein a first distance between the first signal line and the second signal line included in any one of the first 3-phase interface and the second 3-phase interface is smaller than a second distance between the second signal line of the second 3-phase interface and the first signal line of the first 3-phase interface.
An electronic device comprising:
- a printed circuit board;
- a processor;
- and at least one electronic component electrically connected to the processor through the printed circuit board, wherein the printed circuit board comprises:
- a first wiring layer comprising a plurality of first signal lines and a plurality of first dummy lines;
- and a second wiring layer comprising a plurality of second signal lines and a plurality of second dummy lines, wherein each of the first signal lines is arranged to face one of the second dummy lines, and each of the second signal lines is arranged to face one of the first dummy lines, wherein the printed circuit board is configured to provide a plurality of 3-phase interfaces by combining one of the plurality of first signal lines with two of the plurality of second signal lines adjacent thereto to form a first 3-phase interface and combining one of the plurality of second signal lines with two of the plurality of first signal lines adjacent thereto to form a second 3-phase interface, wherein a first distance between the first signal line and the second signal line included in any one of the first 3-phase interface and the second 3-phase interface is smaller than a second distance between the second signal line of the second 3-phase interface and the first signal line of the first 3-phase interface, and wherein the processor is configured to transmit or receive an electrical signal to or from the electronic component through the 3-phase interfaces.
Dependencies are inferred from the claim text.