Semiconductor device package and acoustic device including the same

A wireless earphone, comprising:

• a semiconductor device package;
• a battery, wherein the semiconductor device package and the battery are arranged along a first axis of the wireless earphone;
• a speaker, wherein the battery and the speaker are arranged along a second axis of the wireless earphone substantially perpendicular to the first axis;
• and
• a housing encapsulating the semiconductor device package, the battery, and the speaker;
• wherein the battery has a planar surface and a curved surface, wherein the planar surface faces the speaker;
• wherein the semiconductor device package is disposed over the curved surface of the battery and the speaker is disposed over the planar surface of the battery;
• wherein the housing has a first surface extending upwardly from an end of the wireless earphone configured to be plugged into an ear canal to a top end of the housing and a second surface extending downwardly from the end of the wireless earphone to a bottom end of the housing;
• wherein a first slope of the first surface of the housing is higher than a second slope of the second surface of the housing;
• wherein a first curvature of the first surface of the housing is different from a second curvature of the second surface of the housing;
• wherein the semiconductor device package is disposed in a first space of the housing, wherein the speaker and the battery are disposed in a second space of the housing different from the first space, and wherein the first surface of the housing overlaps the first space and the second space in a direction along the second axis;
• and
• wherein the second surface of the housing overlaps the second space but does not overlap the first space in the direction along the second axis.