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US 11,689,790 B2Granted
Heatsinks for an image capture device
AssigneeGoPro, Inc.
InventorsNicholas Vitale, Raul Vargas Gonzalez, Herman Wong
Life of this patent
Estimating the term…
Abstract
An image capture device that includes a housing and a heatsink located partially or completely within the housing. The heatsink comprises a planar surface, a printed circuit board in communication with the heatsink, and a sheet conductor that is a graphite sheet connected to the planar surface of the heatsink and in direct contact with the printed circuit board or components of the printed circuit board.
Claims20
An image capture device comprising:
- a housing;
- a heatsink located partially or completely within the housing, wherein the heatsink comprises:
- a planar surface;
- and
- a cutout adjacent to the planar surface that is configured to allow a portion of an integrated sensor and lens assembly (ISLA) to extend through the cutout and connect to the housing;
- a printed circuit board in communication with the heatsink;
- a sheet conductor that is a graphite sheet connected to the planar surface of the heatsink and in direct contact with the printed circuit board or components of the printed circuit board;
- and
- a conductor that in communication with the printed circuit board and extends over the printed circuit board and the heatsink where the conductor connects to the heatsink.
6 more elements
An image capture device comprising:
- a heatsink comprising:
- a planar surface and a cut-out that are adjacent;
- and
- a sheet conductor covering a portion of the planar surface of the heatsink, wherein the sheet conductor has a thickness that is less than the thickness of the heatsink and the sheet conductor is made of a material that has a higher thermal conductivity than the material of the heatsink;
- an integrated sensor and lens assembly (ISLA) having a portion that extends through the cut-out a printed circuit board comprising a microprocessor, a power circuit, or both on a rear surface of the printed circuit board, wherein a forward surface of the printed circuit board is in communication with the planar surface through the sheet conductor and the rear surface of the printed circuit board faces away from the planar surface;
- and
- a thermal interface material located between the sheet conductor and the planar surface of the heatsink.
4 more elements
An image capture device comprising:
- a housing;
- a heatsink located partially or completely within the housing, wherein the heatsink comprises a planar surface and a cut-out adjacent to the planar surface;
- an integrated sensor and lens assembly (ISLA) having a portion that extends through the cut-out;
- a printed circuit board in communication with the heatsink;
- a sheet conductor located between and in direct contact with the planar surface of the heatsink and the printed circuit board;
- a connector connecting the sheet conductor to the heatsink;
- a conductor that extends from a rear side of the printed circuit board to a front side of the heatsink so that heat is distributed about the heatsink;
- and
- a thermal interface material between the sheet conductor and the rear side of the printed circuit board.
6 more elements
Dependencies are inferred from the claim text.