Radio frequency module and communication device

A radio frequency module, comprising:

• a first transmission power amplifier that includes a plurality of amplifying elements that are cascaded;
• a first reception low noise amplifier;
• and
• a module board on which the first transmission power amplifier and the first reception low noise amplifier are mounted, wherein
• the plurality of amplifying elements include:
• a first amplifying element disposed most downstream of the plurality of amplifying elements, and
• a second amplifying element disposed upstream of the first amplifying element,
• the module board includes a first principal surface and a second principal surface on opposite sides of the module board,
• the first amplifying element is mounted on one of the first principal surface and the second principal surface, and
• the second amplifying element is mounted on a remaining one of the first principal surface and the second principal surface.

A communication device, comprising:

• a radio frequency (RF) signal processing circuit configured to process radio frequency signals transmitted and received by an antenna;
• and
• a radio frequency module configured to transfer the radio frequency signals between the antenna and the RF signal processing circuit, wherein
• the radio frequency module includes:
• a first transmission power amplifier that includes a plurality of amplifying elements that are cascaded,
• a first reception low noise amplifier, and
• a module board on which the first transmission power amplifier and the first reception low noise amplifier are mounted,
• the plurality of amplifying elements include:
• a first amplifying element disposed most downstream of the plurality of amplifying elements, and
• a second amplifying element disposed upstream of the first amplifying element,
• the module board includes a first principal surface and a second principal surface on opposite sides of the module board,
• the first amplifying element is mounted on one of the first principal surface and the second principal surface,
• the first reception low noise amplifier is mounted on a remaining one of the first principal surface and the second principal surface, and
• in a plan view of the module board, the second amplifying element is physically disposed between the first amplifying element and the first reception low noise amplifier.