Resonator device
AssigneeSeiko Epson Corporation
InventorNorio Nomura
Life of this patent
Estimating the term…
Abstract
A resonator device includes: a resonator element; a first package that accommodates the resonator element; and a second package in which the first package is accommodated and fixed. The first package includes a base substrate that has a first surface on which the resonator element is disposed and a second surface which is in a front-back relationship with the first surface, and that contains single crystal silicon, an integrated circuit that is provided on the first surface or the second surface and that includes a temperature sensor circuit and a heater circuit, and a lid that is bonded to the base substrate such that the resonator element is accommodated between the lid and the base substrate.
Claims5
A resonator device, comprising:
- a resonator element;
- a first package that accommodates the resonator element;
- and
- a second package in which the first package is accommodated and fixed, wherein
- the first package includes
- a base substrate that has a first surface on which the resonator element is disposed and a second surface which is in a front-back relationship with the first surface, and that contains single crystal silicon,
- an integrated circuit that is provided on the first surface or the second surface and that includes a temperature sensor circuit and a heater circuit,
- a wirings that is provided on the first surface of the base substrate,
- an internal coupling terminal that is provided on the integrated circuit and electrically coupled to the wiring,
- an external coupling terminal that is provided on the second surface of the base substrate,
- a through electrode configured by filling a conductive material in a through hole penetrating from the first surface to the second surface of the base substrate, and
- a lid that is bonded to the base substrate such that the resonator element is accommodated between the lid and the base substrate, wherein
- the resonator element is disposed on the integrated circuit and bonded to the internal coupling terminal, and
- the wiring and the external coupling terminal are electrically coupled via the through electrode.
Dependencies are inferred from the claim text.