Package comprising stacked filters with a shared substrate cap

A package comprising:

• a first filter comprising a first polymer frame, wherein the first filter comprises a first integrated device that includes:
• a first substrate comprising a first piezoelectric material;
• and
• a first metal layer coupled to a first surface of the first substrate;
• a substrate cap coupled to the first polymer frame such that a first void is formed between the substrate cap and the first filter, wherein the first void is defined by at least the first filter, the first polymer frame and the substrate cap;
• a second filter comprising a second polymer frame,
• wherein the second polymer frame is coupled to the substrate cap such that a second void is formed between the substrate cap and the second filter,
• wherein the second void is defined by at least the second filter, the second polymer frame and the substrate cap, and
• wherein the second filter comprises a second integrated device that includes:
• a second substrate comprising a second piezoelectric material;
• and
• a second metal layer coupled to a first surface of the second substrate;
• at least one interconnect coupled to the first filter and the second filter, wherein the at least one interconnect is coupled to a surface of the first polymer frame, a surface of the substrate cap and a surface of the second polymer frame;
• an encapsulation layer encapsulating the first filter, the substrate cap, the second filter, and the at least one interconnect;
• and
• a plurality of through encapsulation vias coupled to the first filter, wherein at least one through encapsulation via is coupled to and directly touching the first metal layer of the first filter.