Electronic device and manufacturing method therefor
AssigneeMurata Manufacturing Co., Ltd.
InventorsShigeo Ojima, Isao Ikeda, Koki Sai
Life of this patent
Estimating the term…
Abstract
An electronic device that includes a base substrate having a mounting surface; an electronic component having a mechanical vibration portion mounted on the mounting surface of the base substrate; an intermediate layer mounted on the base substrate and forming an internal space with the base substrate so as to accommodate the electronic component therein, the intermediate layer having at least one through-hole that opens the internal space to an outside; and a sealing layer on the intermediate layer and sealing the internal space by closing the at least one through-hole.
Claims11
An electronic device comprising:
- a base substrate having a mounting surface;
- an electronic component having a mechanical vibration portion mounted on the mounting surface of the base substrate;
- an intermediate layer mounted on the base substrate and forming an internal space with the base substrate so as to accommodate the electronic component therein, the intermediate layer having at least one through-hole that opens the internal space to an outside;
- and
- a sealing layer on the intermediate layer and sealing the internal space by closing the at least one through-hole,
- wherein the base substrate includes:
- an electrode pad on the mounting surface and joined to the electronic component,
- a castellation electrode on an end surface of the base substrate, and
- a base wire electrically connecting the electrode pad and the castellation electrode, and
- wherein the sealing layer is joined to the base substrate and covers part of the base wire.
A manufacturing method for an electronic device, the manufacturing method comprising:
- preparing an aggregate substrate by:
- preparing a mother base;
- forming a via hole extending through the mother base;
- and
- providing a via electrode covering an internal surface of the via hole;
- forming a first sacrificial layer on the aggregate substrate;
- mounting an electronic component on the aggregate substrate such that the first sacrificial layer supports a part of the electronic component having a mechanical vibration portion;
- forming an electrode pad electrically connected to the electronic component and a base wire electrically connected to the via electrode on the aggregate substrate;
- covering the electronic component with a second sacrificial layer;
- covering the second sacrificial layer with an intermediate layer having at least one through-hole that extends through the intermediate layer to the second sacrificial layer;
- forming an internal space between the aggregate substrate and the intermediate layer by removing the first sacrificial layer and the second sacrificial layer through the at least one through-hole;
- sealing the internal space by closing the at least one through-hole with a sealing layer;
- joining the sealing layer with the aggregate substrate so as to cover part of the base wire;
- and
- after the sealing of the internal space by closing the at least one through-hole with the sealing layer, singulating the aggregate substrate into a base substrate along the via electrode so as to form a castellation electrode at an end surface of the base substrate.
Dependencies are inferred from the claim text.