Radio communication apparatus

A radio communication apparatus comprising:

• a printed board;
• an RF circuit formed on one surface of the printed board and configured to generate a plurality of RF signals;
• a plurality of first transmission lines configured to transmit the plurality of RF signals;
• a plurality of second transmission lines configured to transmit a plurality of signals different from the plurality of RF signals;
• a first ground layer formed on another surface of the printed board;
• a plurality of antenna elements configured to emit the plurality of RF signals supplied from the RF circuit through the plurality of first transmission lines, respectively;
• and
• a connection layer configured to bond together the plurality of antenna elements and the first ground layer, wherein
• each of the plurality of antenna elements comprises:
• a plurality of layered dielectric substrates;
• a metal film formed on surfaces of the plurality of dielectric substrates;
• and
• a through hole formed to penetrate at least a dielectric substrate closest to the printed board among the plurality of dielectric substrates, the first ground layer, and the connection layer,
• each of the plurality of first transmission lines is disposed from the RF circuit to an area facing the through hole on the one surface of the printed board, and
• a part of each of the plurality of second transmission lines is disposed between any of the plurality of layered dielectric substrates.