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US 11,688,842 B2Granted
Light emitting diodes with enhanced thermal sinking and associated methods of operation
AssigneeMicron Technology, Inc.
InventorsKevin Tetz, Charles M. Watkins
Life of this patent
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Abstract
Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.
Claims20
A solid state lighting (SSL) device, comprising:
- a substrate;
- a plurality of SSL dies carried by the substrate, wherein each of the plurality of SSL dies includes an emissions area and is encapsulated by and in direct contact with a discrete layer of insulating material, the layer of insulating material being at least partially transparent;
- a monolithic layer of conduction material encapsulating each of the plurality of SSL dies and completely filling a space laterally separating adjacent ones of the plurality of SSL dies, the conduction material in direct contact with the substrate under the space;
- a converter material disposed over the monolithic layer of conduction material and positioned in line with the emissions area of each of the plurality of SSL dies such that emissions from the plurality of SSL dies pass through the converter material.
1 more element
A solid state lighting (SSL) device, comprising:
- a substrate;
- a plurality of SSL dies carried by the substrate, wherein each of the plurality of SSL dies includes an emissions area and is encapsulated by and in direct contact with a discrete layer of insulating material, the layer of insulating material being at least partially transparent;
- a conduction material encapsulating each of the plurality of SSL dies and disposed in a space laterally separating adjacent ones of the plurality of SSL dies, the conduction material in direct contact with the substrate under the space;
- a converter material disposed over each of the plurality of SSL dies and in direct contact with the conduction material, the converter material positioned in line with the emissions area of each of the plurality of SSL dies such that emissions from the plurality of SSL dies pass through the converter material.
1 more element
Dependencies are inferred from the claim text.