Semiconductor device and method for manufacturing the same
AssigneeNanya Technology Corporation
InventorChuan-Lin Hsiao
Life of this patent
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Abstract
The present disclosure provides a semiconductor device having a buried wordline. The semiconductor device includes a substrate having a surface and a first dielectric layer extending from the surface of the substrate into the substrate. The semiconductor device also includes a second dielectric layer disposed on the first dielectric layer and extending from the surface of the substrate into the substrate and a first conductive layer disposed in the substrate and separated from the substrate by the first dielectric layer and the second dielectric layer.
Claims16
A semiconductor device, comprising:
- a substrate having a surface;
- a first dielectric layer extending from the surface of the substrate into the substrate;
- a second dielectric layer disposed on the first dielectric layer and extending from the surface of the substrate into the substrate;
- a first conductive layer disposed in the substrate and separated from the substrate by the first dielectric layer and the second dielectric layer;
- and
- a second conductive layer disposed in the substrate and separated from the substrate by a third dielectric layer;
- wherein a density of the second dielectric layer is different from a density of the first dielectric layer;
- wherein the first conductive layer and the second conductive layer are configured to receive different voltages.
A semiconductor device, comprising:
- a substrate having a surface;
- a first dielectric layer extending from the surface of the substrate into the substrate;
- a first conductive layer disposed in the substrate and separated from the substrate by the first dielectric layer;
- a second dielectric layer extending from the surface of the substrate into the substrate;
- and
- a second conductive layer disposed in the substrate and separated from the substrate by the second dielectric layer;
- wherein the first dielectric layer and the second dielectric layer have different thicknesses;
- wherein the first conductive layer and the second conductive layer are configured to receive different voltages.
Dependencies are inferred from the claim text.