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US 11,688,750 B2Granted
Modular fingerprint recognition package having reduced size
AssigneeSamsung Electronics Co., Ltd.
InventorsMi-Jin Kim, Seong-Jun Kim, Kyo-Ree Lee, Tae-Sang Park, Tack-Mo Lee
Life of this patent
Estimating the term…
Abstract
A fingerprint recognition package may include a circuit board; an image sensor die attached and electrically connected to the circuit board; a light-shielding member applied to the circuit board; and an adhesive member attached to one side of the light-shielding member. The light-shielding member can be cured by being irradiated with ultraviolet rays, and can be thermoset by being irradiated with heat.
Claims10
A fingerprint recognition package comprising:
- a circuit board;
- an image sensor die attached and electrically connected to the circuit board;
- a light-shielding member applied to the circuit board and to side edges of the image sensor die, the light-shielding member configured to seal a periphery of the image sensor die;
- and
- an adhesive member attached to one side of the light-shielding member, the adhesive member comprising a cohesion layer,
- wherein the fingerprint recognition package is configured to use a light source emitted from a display mounted outside the fingerprint recognition package, wherein the light source is reflected by a user fingerprint, and
- wherein the image sensor die is configured to detect an image of the user fingerprint.
4 more elements
Dependencies are inferred from the claim text.