Electronic device

An electronic device comprising:

• a substrate having a first surface and a second surface that are in a front and back relationship with each other;
• a first electronic component mounted on the first surface of the substrate;
• a cap accommodating the first electronic component between the cap and the substrate;
• and
• a mold portion bonding the cap and the substrate, wherein
• the cap includes abase portion having a recess that opens to a substrate side and accommodates the first electronic component, and a flange portion that protrudes from an end portion of the base portion on the substrate side to an outer peripheral side and is in contact with the first surface,
• the mold portion is provided from a second surface side of the substrate to a first surface side while bypassing a side, and bonds the cap and the substrate by molding the flange portion in a portion on the first surface side, and
• the flange portion includes a mold region that is molded with the mold portion and a non-mold region that is not molded with the mold portion.