Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsSangkil Lee, So-young Kim, Soo-woong Ahn
Life of this patent
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Abstract
Disclosed is a semiconductor package comprising a logic die mounted on an interposer substrate, and a memory stack structure disposed side-by-side with the logic die. The memory stack structure includes a buffer die mounted on the interposer substrate, and a plurality of memory dies stacked on the buffer die. The buffer die has a first surface that faces the interposer substrate and a second surface that faces the plurality of memory dies. The number of data terminals on the second surface is greater the number of connection terminals on the first surface.
Claims8
A semiconductor package, comprising:
- a logic die provided on an interposer substrate;
- and
- a memory stack structure provided adjacent to the logic die,
- wherein the memory stack structure comprises:
- a buffer die on the interposer substrate;
- and
- a plurality of memory dies stacked on the buffer die,
- wherein the plurality of memory dies include:
- a first memory die that is a lowermost one of the plurality of memory dies;
- and
- a second memory die on the first memory die,
- wherein the first memory die includes first data terminals between the first memory die and the buffer die,
- wherein the second memory die includes second data terminals between the second memory die and the first memory die,
- wherein a number of the first data terminals is different from a number of the second data terminals,
- wherein the buffer die includes connection terminals between the buffer die and the interposer substrate, and
- wherein a number of the first data terminals is greater than a number of the connection terminals.
Dependencies are inferred from the claim text.