Semiconductor chip mounting tape and method of manufacturing semiconductor package using the tape

A method of manufacturing a semiconductor package, the method comprising:

• providing a substrate including connection pads, the substrate including a top surface and a bottom surface;
• placing, on the connection pads, a first semiconductor chip including a first connection terminal and a second semiconductor chip different from the first semiconductor chip and including a second connection terminal, each of the first semiconductor chip and second semiconductor chip including a top surface, and a bottom surface facing the top surface of the substrate;
• providing an adhesive film and a tape base film contacting each other to form a chip mounting tape, the adhesive film including a plurality of voids therein;
• attaching the chip mounting tape to the top surface of the substrate and the top surfaces of the first and second semiconductor chips;
• loading the substrate to which the chip mounting tape is attached into a chamber;
• increasing an internal pressure and an internal temperature of the chamber to electrically connect the connection pads and the first and second connection terminals, respectively;
• and
• separating the chip mounting tape from the substrate and the first and second semiconductor chips,
• wherein the attaching of the chip mounting tape includes attaching the first and second semiconductor chips to a bottom surface of the adhesive film, and
• wherein the increasing of the internal pressure includes:
• reducing a thickness of the adhesive film by decreasing in volume each of the plurality of voids, and
• applying a force to the tape base film towards the substrate by reducing the thickness of the adhesive film to electrically connect the connection pads and the first and second connection terminals.

A method of manufacturing a semiconductor package, the method comprising:

• providing a substrate including connection pads, the substrate including a top surface and a bottom surface;
• placing, on the connection pads, a first semiconductor chip including a first connection terminal and a second semiconductor chip different from the first semiconductor chip and including a second connection terminal, each of the first semiconductor chip and second semiconductor chip including a top surface, and a bottom surface facing the top surface of the substrate;
• providing an adhesive film and a tape base film contacting each other to form a chip mounting tape, the adhesive film including a plurality of voids therein;
• attaching the chip mounting tape to the top surface of the substrate and the top surfaces of the first and second semiconductor chips;
• loading the substrate to which the chip mounting tape is attached into a chamber, wherein the chip mounting tape seals the top surfaces of the first and second semiconductor chips and the top surface of the substrate from a region in the chamber above the substrate and first and semiconductor chips;
• increasing an internal pressure and an internal temperature of the chamber to electrically connect the connection pads and the first and second connection terminals, respectively;
• and
• separating the chip mounting tape from the substrate and the first and second semiconductor chips,
• wherein the increasing of the internal pressure and the internal temperature of the chamber includes:
• reducing a thickness of the adhesive film by decreasing in volume each of the plurality of voids, and
• applying a force to the tape base film towards the substrate by reducing the thickness of the adhesive film to electrically connect the connection pads and the first and second connection terminals.