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US 11,688,715 B2Granted
Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame
AssigneeSTMicroelectronics S.r.l.
InventorsRennier Rodriguez, Rammil Seguido, Raymond Albert Narvadez, Michael Tabiera
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Abstract
The present disclosure is directed to a semiconductor die with multiple contact pads electrically coupled to a single lead via a single wire, and methods for fabricating the same. In one or more embodiments, multiple contact pads are electrically coupled to each other by a plurality of conductive layers stacked on top of each other. The uppermost conductive layer is then electrically coupled to a single lead via a single wire.
Claims20
A device, comprising:
- a frame including a lead;
- a die including a first contact pad and a second contact pad;
- a first conductive bump on the first contact pad;
- a second conductive bump on the second contact pad;
- a third conductive bump on a surface of the first conductive bump and a surface of the second conductive bump, the third conductive bump partially covering the surface of the first conductive bump and the surface of the second conductive bump;
- and
- a wire coupled to the third conductive bump and the lead.
4 more elements
A method, comprising:
- positioning a die on a frame, the die including a first contact pad and a second contact pad, the frame including a lead;
- forming a first conductive bump on the first contact pad;
- forming a second conductive bump on the second contact pad;
- forming a third conductive bump on a surface of the first conductive bump and a surface of the second conductive bump, the third conductive bump partially covering the surface of the first conductive bump and the surface of the second conductive bump;
- and
- coupling a wire to the third conductive bump and the lead.
3 more elements
A device, comprising:
- a frame including a lead;
- a die including a first contact pad and a second contact pad;
- a first conductive bump on the first contact pad;
- a second conductive bump on the second contact pad and abutting the first conductive bump;
- a third conductive bump on the first conductive bump and the second conductive bump;
- and
- a wire coupled to the third conductive bump and the lead.
4 more elements
Dependencies are inferred from the claim text.