Semiconductor device having second connector that overlaps a part of first connector
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorYoshiharu Takada
Life of this patent
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Abstract
A semiconductor device includes a first lead portion and a second lead portion spaced from each other in a first direction. A semiconductor chip is mounted to the first lead portion. A first connector has a first portion contacting a second electrode on the chip and a second portion connected to the second lead portion. A second connector has third portion that contacts the second electrode, but at a position further away than the first portion, and a fourth portion connected to the second portion. At least a part of the second connector overlaps a part of the first connector between the first lead portion and the second lead portion.
Claims13
A packaged semiconductor device, comprising:
- a first lead frame;
- a semiconductor chip mounted on the first lead frame, the semiconductor chip having a first electrode facing the first lead frame and electrically connected to the first lead frame, a second electrode of the semiconductor chip facing away from the first lead frame;
- a first connector comprising a first edge and a second edge, the first connector extending from the first edge to the second edge in a first direction, the first edge contacting the second electrode at a first position;
- and
- a second connector comprising a third edge and a fourth edge, the second connector extending from the third edge to fourth edge in the first direction, the third edge contacting the second electrode at a second position farther away from the fourth edge of the second connector in the first direction than the third edge of the second connector, wherein
- the second connector includes a portion that overlaps a portion of the first connector.
A packaged semiconductor device, comprising:
- a first lead frame;
- a semiconductor chip mounted on the first lead frame, the semiconductor chip having a first electrode facing the first lead frame and electrically connected to the first lead frame, a second electrode of the semiconductor chip facing away from the first lead frame;
- a first connector comprising a first connection portion and a second connection portion, the first connector extending from the first connection portion to the second connection portion in a first direction, the first connection portion contacting with the second electrode at a first position;
- and
- a second connector comprising a third connection portion, the second connector extending from the third connection portion in the first direction, the third connection portion contacting with the second electrode at a second position further away from the second connection portion of the first connector in the first direction than the third connection portion of the second connector, wherein
- the second connector includes a portion that overlaps a portion of the first connector, and
- the second connection portion of the first connector is connected to the second connector.
Dependencies are inferred from the claim text.