Integrated device packages with passive device assemblies
AssigneeAnalog Devices, Inc.
InventorsVikram Venkatadri, Santosh Anil Kudtarkar
Life of this patent
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Abstract
An integrated device package is disclosed. The package can include a package substrate and an integrated device die having active electronic circuitry. The integrated device die can have a first side and a second side opposite the first side. The first side can have bond pads electrically connected to the package substrate by way of bonding wires. A redistribution layer (RDL) stack can be disposed on a the first side of the integrated device die. The RDL stack can comprise an insulating layer and a conductive redistribution layer. The package can include a passive electronic device assembly mounted and electrically connected to the RDL stack.
Claims17
An integrated device package comprising:
- a package substrate;
- an integrated device die having active electronic circuitry, the integrated device die having a first side and a second side opposite the first side, the first side comprising bond pads electrically connected to the package substrate by way of bonding wires, the integrated device die disposed over the package substrate such that the second side faces the package substrate, the bonding wires extending from the bond pads at the first side of the integrated device die to the package substrate;
- a redistribution layer (RDL) stack disposed on the first side of the integrated device die, the RDL stack comprising an insulating layer and a conductive redistribution layer;
- and
- a passive electronic device assembly mounted and electrically connected to the RDL stack, the passive electronic device assembly disposed over the integrated device die,
- wherein the passive electronic device assembly comprises an interposer mounted to the RDL stack and one or more passive electronic devices mounted to the interposer, and
- wherein the one or more passive electronic devices lie within a lateral footprint of the integrated device die and within a lateral footprint of the package substrate.
A sensor module comprising:
- an electronic device comprising:
- an element and a redistribution layer (RDL) stack disposed on a first side of the element, the RDL stack comprising an insulating layer and a conductive redistribution layer, the first side of the element comprising bond pads electrically connected to a package substrate by way of bonding wires, and
- a passive electronic device assembly mounted and electrically connected to the RDL stack,
- wherein the passive electronic device assembly comprises an interposer mounted to the RDL stack and one or more passive electronic devices mounted to the interposer, wherein the one or more passive electronic devices lie within a lateral footprint of the RDL stack and within a lateral footprint of the package substrate;
- and
- an imaging sensor assembly, the electronic device mounted to the imaging sensor assembly.
Dependencies are inferred from the claim text.