Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsJoonho Jun, Sangsick Park, Unbyoung Kang
Life of this patent
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Abstract
Provided is a semiconductor package including: a first substrate having a first electrode pad and a first protective layer in which a cavity is formed; a first bump pad arranged in the cavity and connected to the first electrode pad; a second substrate facing the first substrate and having a second bump pad; and a bump structure in contact with the first bump pad and the second bump pad, wherein the first electrode pad has a trapezoidal shape, and the first bump pad has a flat upper surface and an inclined side surface extending along a side surface of the first electrode pad.
Claims18
A semiconductor package comprising:
- a first substrate having a first electrode pad and a first protective layer in which a cavity is formed;
- a first bump pad arranged in the cavity and connected to the first electrode pad;
- a second substrate facing the first substrate and having a second bump pad;
- a bump structure in contact with the first bump pad and the second bump pad;
- a first through electrode penetrating the first substrate;
- and
- a second through electrode penetrating the second substrate,
- wherein a surface on which the first bump pad is formed is an inactive surface of the first substrate, and
- wherein a surface on which the second bump pad is formed is an active surface of the second substrate,
- wherein the first electrode pad has a trapezoidal shape,
- wherein the first bump pad has a flat upper portion and an inclined side portion extending along a side surface of the first electrode pad, and
- wherein a lowermost surface of the inclined side portion of the first bump pad and a lower surface of the first electrode pad are in contact with a top surface of the first protective layer in the cavity.
A semiconductor package comprising:
- a first substrate having a first surface, a first through electrode protruding toward the first surface, and a first protective layer having a cavity formed toward the first surface;
- a first bump pad arranged in the cavity and connected to the first through electrode;
- a second substrate having a second surface facing the first surface and including a second through electrode protruding toward the second surface;
- a second bump pad on the second surface and connected to the second through electrode;
- and
- a bump structure in contact with the first bump pad and the second bump pad, respectively,
- wherein the first bump pad has an upper portion and an inclined side portion extending from the upper portion, and an angle formed by the upper portion and the inclined side portion is greater than about 90° and less than about 180°.
A semiconductor package comprising:
- a first substrate having a redistribution layer formed on an inactive surface, a first trapezoidal electrode pad connected to the redistribution layer, and a first protective layer having a cavity;
- a first bump pad arranged in the cavity and covering both upper and side surfaces of the first trapezoidal electrode pad;
- a second substrate having a second bump pad on an active surface;
- and
- a bump structure in contact with the first bump pad and the second bump pad,
- wherein the first bump pad has a flat upper portion and an inclined side portion extending along a side surface of the first trapezoidal electrode pad, and an angle formed by the upper portion and the inclined side portion is greater than about 90° and less than about 180°.
Dependencies are inferred from the claim text.