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US 11,688,702 B2Granted
Semiconductor devices having an electro-static discharge protection structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorYi-Feng Chang
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Abstract
A semiconductor device includes a substrate and a metallization layer. The substrate has an active region that includes opposite first and second edges. The metallization layer is disposed above the substrate, and includes a pair of metal lines and a metal plate. The metal lines extend from an outer periphery of the active region into the active region and toward the second edge of the active region. The metal plate interconnects the metal lines and at least a portion of which is disposed at the outer periphery of the active region.
Claims20
A semiconductor device comprising:
- a substrate having an active region that includes opposite first and second edges;
- a first metallization layer disposed above the substrate, and including a first sublayer and a second sublayer, the first sublayer comprises:
- a pair of first metal lines that extend from an outer periphery of the active region toward the second edge of the active region,
- a first metal plate that interconnects the first metal lines and that is disposed at the outer periphery of the active region,
- a pair of second metal lines, and
- a second metal plate that horizontally interconnects the pair of second metal lines;
- and
- a plurality of second metallization layers each disposed between the substrate and the first metallization layer including:
- a plurality of distinct metal lines that are parallel to each other and arranged along a length of the active region underneath all of the first pair of metal lines and the second pair of metal lines, wherein the plurality of distinct metal lines have a first end at a position underneath an intermediate portion of the first metal plate, and a length that extends to a second end at a position underneath an intermediate portion of the second metal plate, wherein the plurality of distinct metal lines are of equal length to each other, and each distinct metal line of the plurality of distinct metal lines serves as a horizontal interconnect.
6 more elements
A system comprising:
- an electronic component;
- a substrate having an active region in which the electronic component is disposed that includes opposite first and second edges;
- and
- metallization layer means comprising first metallization layer means and second metallization layer means disposed between the first metallization layer means and the substrate having an area that extends across only a subset of an area of the first metallization layer means, the first metallization layer means including a pair of first metal lines, a first metal plate that interconnects the first metal lines, a pair of second metal lines, and a second metal plate that interconnects the second metal lines, the second metallization layer means including a plurality of distinct metal lines that are parallel to each other and arranged along a length of the active region, wherein the plurality of distinct metal lines are of equal length to each other, and each distinct metal line of the plurality of distinct metal lines serves as a horizontal interconnect, wherein the plurality of distinct metal lines have a first end at a position underneath an intermediate portion of the first metal plate, and a length that extends to a second end at a position underneath an intermediate portion of the second metal plate.
1 more element
An apparatus comprising:
- an electronic component;
- a substrate having an active region that includes opposite first and second edges;
- a plurality of first metallization layers disposed above the substrate, and each including a first sublayer and a second sublayer, the first sublayer comprises:
- a pair of first metal lines that extend from an outer periphery of the active region toward the second edge of the active region,
- a first metal plate that interconnects the first metal lines and that is disposed at the outer periphery of the active region,
- a pair of second metal lines, and
- a second metal plate that horizontally interconnects the pair of second metal lines;
- and
- a plurality of second metallization layers disposed between the substrate and the plurality of first metallization layers each including:
- a plurality of distinct metal lines that are parallel to each other and arranged along a length of the active region, wherein the plurality of distinct metal lines are of equal length to each other, and each distinct metal line of the plurality of distinct metal lines serves as a horizontal interconnect;
- wherein each of the second metallization layers has a shape and size that extends laterally underneath all of the first pair of metal lines and the second pair of metal lines and underneath only a subset of a length of both of the first metal plate and the second metal plate.
8 more elements
Dependencies are inferred from the claim text.