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US 11,688,700 B2Granted
Die package having security features
AssigneeRaytheon Company
InventorsJason M. Kehl, Jason G. Milne, Steve F. Mayrose, Aaron George
Life of this patent
Estimating the term…
Abstract
Methods and apparatus for providing an assembly including a base substrate, a lid substrate, and a ring frame between the base substrate and the lid substrate to define a protected volume, where the ring frame includes through vias. A die may be contained in the protected volume. Sensor circuitry can include conductive pillars in the protected volume and the die can include circuity to determine an impedance of the pad and the pillars for tamper detection. An edge cap can be coupled to at least one side of the assembly for tamper detection.
Claims19
An assembly, comprising:
- a base substrate;
- a lid substrate;
- a ring frame connected to the base substrate and the lid substrate to define a protected volume, wherein the ring frame includes through vias that extend through the ring frame from a top of the ring frame to a bottom of the ring frame;
- a die contained in the protected volume,
- wherein at least some of the through vias in the ring frame have conductive material exposed on an outer surface of the ring frame, and further including:
- at least one edge cap coupled to at least one side of the assembly, wherein the at least one edge cap comprises a conductive trace in electrical contact with the exposed conductive material of at least one of the vias.
3 more elements
Dependencies are inferred from the claim text.