Emi shielding for flip chip package with exposed die backside

A semiconductor device, comprising:

• a semiconductor die;
• an encapsulant deposited around the semiconductor die;
• a conductive layer formed over the encapsulant and semiconductor die;
• and
• a solder paste disposed over the conductive layer.

A method of making a semiconductor device, comprising:

• providing a semiconductor die;
• depositing an encapsulant around the semiconductor die;
• forming a conductive layer over the encapsulant and semiconductor die;
• disposing a solder paste over the conductive layer;
• and
• disposing a heat spreader over the solder paste.

A method of making a semiconductor device, comprising:

• providing a semiconductor die;
• depositing an encapsulant around the semiconductor die;
• forming a conductive layer over the encapsulant and semiconductor die;
• and
• disposing a solder paste over the conductive layer.