Integrated fan-out package with 3D magnetic core inductor

A method of fabricating an integrated electronic device package including an inductor, the method comprising:

• forming first trace portions on top of a first electrically insulating layer of a package structure, the first trace portions being electrically conductive;
• forming a molding material over and around exposed surfaces of a die above a second electrically insulating layer and exposed surfaces of vias on the first electrically insulating layer;
• planarizing the molding material and forming a trench therein;
• forming a magnetic material in the trench and forming electrically insulating material over the magnetic material in the trench, so that the magnetic material in the trench is electrically insulated;
• and
• forming second trace portions covering a top surface of the molding material and the magnetic material, the second trace portions being electrically conductive and being electrically connected to corresponding vias, such that the first trace portions, the vias, and the second trace portions form an inductor spanning multiple layers of the package structure, with coils of the inductor surrounding the magnetic material in the trench, at least some of the vias of the inductor being embedded in the molding material of a first layer along with the die.

A method of fabricating an integrated electronic device package including an inductor, the method comprising:

• forming first trace portions on top of a first electrically insulating layer of a package structure, the first trace portions being electrically conductive;
• forming vias in a sacrificial layer disposed on the first electrically insulating layer;
• removing the sacrificial layer, and forming a second electrically insulating layer on the first electrically insulating layer;
• placing a die above the second electrically insulating layer;
• forming a molding material over and around exposed surfaces of the die and exposed surfaces of the vias;
• planarizing the molding material and forming a trench therein;
• forming a magnetic material in the trench and forming electrically insulating material over the magnetic material in the trench, so that the magnetic material in the trench is electrically insulated;
• and
• forming second trace portions covering a top surface of the molding material and the magnetic material, the second trace portions being electrically conductive and being electrically connected to corresponding vias, such that the first trace portions, the vias, and the second trace portions form an inductor spanning multiple layers of the package structure, with coils of the inductor surrounding the magnetic material in the trench, at least some of the vias of the inductor being embedded in the molding material of a first layer along with the die.