Printed circuit board and electronic component package

A printed circuit board, comprising:

• a first insulating layer;
• a first external connection pad and a second external connection pad embedded in the first insulating layer, the second external connection pad being spaced apart from the first external connection pad;
• and
• a second insulating layer comprising a first wiring pattern connected to each of the first external connection pad and the second external connection pad,
• wherein first surfaces of the first and second external connection pads are exposed to a first surface of the first insulating layer and substantially coplanar with the first surface of the first insulating layer,
• the first insulating layer and the second insulating layer are different layers from each other, and
• at least one of the first and second external connection pads includes a plurality of metal layers having a different metal from each other.

An electronic component package, comprising:

• a printed circuit board comprising a first insulating layer, in which an external connection pad is embedded, having a thickness substantially the same as a thickness of the external connection pad, and a second insulating layer having a first surface in contact with the first insulating layer and comprising a first wiring pattern connected to the external connection pad;
• and
• a semiconductor chip connected to the external connection pad,
• wherein the external connection pad includes a metal different from a metal of the first wiring pattern.