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US 11,688,672 B2Granted
Leadframe capacitors
AssigneeTexas Instruments Incorporated
InventorsVijaylaxmi Khanolkar, Sreeram Subramanyam Nasum, Tarunvir Singh
Life of this patent
Estimating the term…
Abstract
An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directly facing one another with a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor. No other side of the first conductive plate directly faces a side of the second conductive plate, and no other side of the second conductive plate directly faces a side of the first conductive plate.
Claims24
A method, comprising:
- positioning a lead frame such that:
- a first side of a first conductive plate is spaced apart from and directly facing a second side of a second conductive plate;
- no other side of the first conductive plate directly faces a side of the second conductive plate;
- and no other side of the second conductive plate directly faces a side of the first conductive plate;
- performing a connection process that electrically connects a first bond wire to a first die and to the first conductive plate, and electrically connects a second bond wire to a second die and to the second conductive plate;
- performing a molding process that forms a package structure which encloses:
- the first die;
- the second die;
- the first bond wire;
- the second bond wire;
- a portion of the first conductive plate;
- and a portion of the second conductive plate;
- and
- separating the first conductive plate, the second conductive plate, and conductive leads from a remaining portion of the lead frame.
11 more elements
A method of making an electronic device, comprising:
- providing a package structure with conductive leads partially exposed outside the package structure;
- mounting a first die to a first die attach pad in the package structure, a first conductive plate in the package structure, the first conductive plate having a first side and a second conductive plate in the package structure, the second conductive plate having a second side;
- mounting a second die to a second die attach pad in the package structure;
- coupling a first bond wire to the first die and to the first conductive plate in the package structure;
- coupling a second bond wire to the second die and to the second conductive plate in the package structure;
- and
- the second side of the second conductive plate being spaced apart from and directly facing the first side of the first conductive plate, a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor, no other side of the first conductive plate directly facing a side of the second conductive plate, and no other side of the second conductive plate directly facing a side of the first conductive plate.
4 more elements
A method, comprising:
- providing a first electronic circuit of a first voltage domain;
- providing a second electronic circuit of a second voltage domain;
- and
- coupling an isolation device with the first and second electronic circuits, the isolation device comprising:
- a package structure;
- a first set of conductive leads partially exposed outside the package structure and coupled to the first electronic circuit;
- a second set of conductive leads partially exposed outside the package structure and coupled to the second electronic circuit;
- a first die mounted to a first die attach pad in the package structure and coupled to the first set of conductive leads;
- a second die mounted to a second die attach pad in the package structure and coupled to the second set of conductive leads;
- a first conductive plate in the package structure, the first conductive plate having a first side;
- a second conductive plate in the package structure, the second conductive plate having a second side;
- a first bond wire coupled to the first die and to the first conductive plate in the package structure;
- a second bond wire coupled to the second die and to the second conductive plate in the package structure;
- and
- the second side of the second conductive plate being spaced apart from and directly facing the first side of the first conductive plate, a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor, no other side of the first conductive plate directly facing a side of the second conductive plate, and no other side of the second conductive plate directly facing a side of the first conductive plate.
12 more elements
A method, comprising:
- spacing a first side of a first conductive plate of a lead frame apart from and directly facing a second side of a second conductive plate of the lead frame, no other side of the first conductive plate directly faces a side of the second conductive plate and no other side of the second conductive plate directly faces a side of the first conductive plate;
- coupling a first die to the first conductive plate with a first bond wire;
- coupling a second die to the second conductive plate with a second bond wire;
- enclosing the first die, the second die, the first bond wire, the second bond wire, a portion of the first conductive plate and a portion of the second conductive plate with a package structure;
- and
- the first conductive plate, the second conductive plate, and conductive leads separated from a remaining portion of the lead frame.
3 more elements
Dependencies are inferred from the claim text.