Semiconductor package having a lead frame including die paddles and method of making the same

A method for fabricating a semiconductor package, the method comprising the steps of:

• providing a lead frame comprising
• a first, second, third and fourth die paddles separated from one another, the first die paddle and the second die paddle facing each other, and the third die paddle and the fourth die paddle facing each other;
• attaching a first low side field-effect transistor (FET), a second low side FET, a first high side FET, and a second high side FET to the first die paddle, the second die paddle, the third die paddle, and the fourth die paddle respectively;
• connecting a drain electrode of the first low side FET to a source electrode of the first high side FET by a first metal clip;
• connecting a drain electrode of the second low side FET to a source electrode of the second high side FET by a second metal clip;
• forming a molding encapsulation enclosing the first low side FET, the second low side FET, the first high side FET, the second high side FET, the first metal clip, the second metal clip, and a majority portion of the lead frame;
• and
• applying a singulation process separating the semiconductor package from adjacent semiconductor packages.