Wiring substrate
AssigneeShinko Electric Industries Co., Ltd.
InventorSatoshi Hondo
Life of this patent
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Abstract
A wiring substrate includes a first insulating layer, a pad on a surface of the first insulating layer, a reinforcement wiring pattern in or on the surface of the first insulating layer, and a second insulating layer on the surface of the first insulating layer. The reinforcement wiring pattern surrounds the pad without contacting the pad in a plan view. The second insulating layer includes an opening in which the pad is exposed without contacting the second insulating layer. The second insulating layer includes an inner side surface defining the opening. The inner side surface is on the reinforcement wiring pattern.
Claims15
A wiring substrate comprising:
- a first insulating layer;
- a pad on a surface of the first insulating layer;
- a reinforcement wiring pattern surrounding the pad without contacting the pad in a plan view, the reinforcement wiring pattern being in or on the surface of the first insulating layer;
- and
- a second insulating layer on the surface of the first insulating layer, the second insulating layer including an opening in which the pad is exposed without contacting the second insulating layer, the second insulating layer including an inner side surface defining the opening, the inner side surface being positioned on the reinforcement wiring pattern,
- wherein the reinforcement wiring pattern has a shape with an opening in a middle in the plan view.
Dependencies are inferred from the claim text.