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US 11,688,668 B2Granted
Component carrier with low shrinkage dielectric material
AssigneeAT&S (China) Co. Ltd.
InventorsMikael Tuominen, Seok Kim Tay
Life of this patent
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Abstract
A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. At least part of the at least one electrically insulating layer structure comprises or consists of a material having a curing shrinkage value of less than 2%.
Claims20
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- wherein at least part of the at least one electrically insulating layer structure comprises or consists of a first material having a curing shrinkage value of less than 2%,
- wherein the stack comprises a core which comprises a second material having a coefficient of thermal expansion value below 15 ppm/K,
- wherein said first material has a value of the Young modulus above 8 GPa,
- wherein the first material and the second material are in direct physical contact with each other and wherein no copper traces are arranged between the first material and the second material.
2 more elements
A method of manufacturing a component carrier, wherein the method comprises:
- providing a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- and
- providing at least part of the at least one electrically insulating layer structure of a first material having a curing shrinkage value of less than 2%,
- wherein the stack comprises a core which comprises a second material having a coefficient of thermal expansion value below 15 ppm/K,
- wherein said first material has a value of the Young modulus above 8 GPa,
- wherein the first material and the second material are in direct physical contact with each other and wherein no copper traces are arranged between the first material and the second material.
3 more elements
Dependencies are inferred from the claim text.