Thermal management solutions for stacked integrated circuit devices

An apparatus, comprising:

• a first integrated circuit device having a first surface;
• a second integrated circuit device having a first surface;
• a plurality of interconnects extending between the first integrated circuit device and the second integrated circuit device;
• a first grouping comprising a first portion of the plurality of interconnects and a sealing structure surrounding the first portion of the plurality of interconnections, wherein the sealing structure of the first grouping provides an electrical connection between the first and second integrated circuit devices;
• a second grouping comprising a second portion of the plurality of interconnects and a sealing structure surrounding the second portion of the plurality of interconnects;
• and
• at least one fluid transport channel between the first surface of the first integrated circuit device and the first surface of the second integrated circuit device, wherein at least a portion of the at least one fluid transport channel is defined by the first integrated circuit device, the second integrated circuit device, the sealing structure of the first grouping, and the sealing structure of the second grouping.