Thermal distribution network for semiconductor devices and associated systems and methods

A semiconductor device, comprising:

• a package substrate;
• a first die carried by the package substrate;
• a spacer carried by the package substrate spaced apart from the first die;
• a stack of second dies at least partially carried by the spacer and at least partially carried by the first die;
• and
• a plurality of thermal pathways, the plurality of thermal pathways including:
• a first thermal pathway extending from an upper surface of the first die to the package substrate between the first die and the spacer;
• and
• a second thermal pathway extending from a lowermost die in the stack of second dies to the package substrate, wherein the first and second thermal pathways are thermally insulated from each other.

A semiconductor device, comprising:

• a package substrate;
• a first die carried by a first region of the package substrate;
• a spacer carried by a second region of the package substrate;
• a thermally conductive component thermally coupled to an upper surface of the first die, wherein the thermally conductive component establishes a thermal path extending from the upper surface of the controller die to a third region of the package substrate horizontally between the first region and the second region;
• one or more second dies at least partially carried by the spacer above the first die and the thermally conductive component;
• and
• an adhesive film insulating the first thermal pathway from the stack of second dies and the second thermal pathway, wherein the adhesive film carries at least a portion of the one or more second dies.