Semiconductor device and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSuin Kim, Jiyong Kim, Sung-Ki Lee
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a first case part, a second case part coupled to the first case part to provide a case, a semiconductor module disposed within the case closer to the second case part than to the first case part, and a plate interposed between the first case part and the semiconductor module. The plate is a thermal conductor, that is a material having thermal conductivity, to transfer heat generated by the semiconductor module to the case where the heat can dissipate to the outside of the semiconductor device.
Claims19
A solid state drive (SSD) comprising:
- a case including a first portion and a second portion coupled to the first portion;
- a semiconductor module disposed within the case;
- and
- a thermal conductor disposed within the case, and disposed between the semiconductor module and the first portion of the case,
- wherein an inner surface of the first portion of the case is uneven, and the thermal conductor is made of metal.
A solid state drive (SSD) comprising:
- a case including a first portion and a second portion coupled to the first portion;
- a semiconductor module disposed within the case;
- a thermal conductor disposed within the case, and disposed between the semiconductor module and the first portion of the case;
- a first heat dissipation member disposed on an inner surface of the first portion of the case;
- a second heat dissipation member in contact with the thermal conductor,
- wherein an inner surface of the first portion of the case is uneven, and
- a thickness of a first part of the inner surface of the first portion of the case is different from a thickness of a second part of the inner surface of the first portion of the case.
A solid state drive (SSD) comprising:
- a case including a first portion and a second portion coupled to the first portion;
- a semiconductor module disposed within the case;
- a thermal conductor disposed within the case, and disposed between the semiconductor module and the first portion of the case;
- a first heat dissipation member disposed on an inner surface of the first portion of the case;
- and
- a second heat dissipation member in contact with the semiconductor module and the thermal conductor,
- wherein an inner surface of the first portion of the case is uneven,
- a thickness of a first part of the inner surface of the first portion of the case is different from a thickness of a second part of the inner surface of the first portion of the case,
- the second heat dissipation member is square-shaped, and
- the thermal conductor is thermally coupled to the first portion of the case.
Dependencies are inferred from the claim text.