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US 11,688,658 B2Granted
Semiconductor device
AssigneeMicron Technology, Inc.
InventorsHyunsuk Chun, Shams U. Arifeen, Chan H. Yoo, Tracy N. Tennant
Life of this patent
Estimating the term…
Abstract
A semiconductor device having a semiconductor die, a redistribution layer (RDL), and an encapsulant. The RDL layer can be formed on a first surface of the semiconductor die. The encapsulant can enclose a second surface and side surfaces of the semiconductor die. The encapsulant can enclose side portions of the RDL.
Claims20
A method of forming a semiconductor device, comprising:
- forming a redistribution layer (RDL) on a carrier substrate;
- forming a first encapsulant on the RDL;
- removing a number of portions out of the first encapsulant;
- detaching the carrier substrate;
- attaching a semiconductor die to the RDL in place of the detached carrier substrate;
- forming a second encapsulant that encloses the semiconductor die and portions of the RDL facing toward but not in contact with the semiconductor die;
- and
- attaching a number of interconnect structures into each of the number of portions removed from the first encapsulant.
5 more elements
A method for forming a semiconductor device, comprising:
- forming a redistribution layer (RDL) on a carrier substrate;
- attaching a number of interconnect structures onto a surface of the RDL opposite the carrier substrate;
- molding a first encapsulant onto the RDL between each of the number of interconnect structures;
- removing at least a portion of the first encapsulant to expose a portion of each of the number of interconnect structures;
- detaching the carrier substrate;
- attaching a semiconductor die to the RDL in place of the detached carrier substrate;
- and
- forming a second encapsulant that encloses the semiconductor die.
5 more elements
A method of forming a semiconductor device, comprising:
- forming a redistribution layer (RDL) on a carrier substrate;
- forming a first encapsulant on a first side of the RDL and on opposing sides of the RDL, wherein a second side of the RDL opposite the first side is in contact with the carrier substrate and the opposing sides are parallel to the first side and the second side;
- removing a number of portions out of the first encapsulant;
- detaching the carrier substrate, exposing the second side of the RDL;
- attaching a semiconductor die to the RDL in place of the detached carrier substrate;
- forming a second encapsulant that encloses the semiconductor die and portions of the second side of the RDL facing toward but not in contact with the semiconductor die;
- and
- attaching a number of interconnect structures into each of the number of portions removed from the first encapsulant.
5 more elements
Dependencies are inferred from the claim text.