Semiconductor devices and methods of manufacturing semiconductor devices

A semiconductor device, comprising:

• a substrate comprising:
• a substrate first side;
• a substrate second side opposite to the substrate first side;
• and
• a conductive structure;
• an electronic component comprising:
• an electronic component first side;
• an electronic component second side opposite to the electronic component first side;
• and
• an electronic component lateral side connecting the electronic component first side to the electronic component second side;
• wherein the electronic component second side is coupled to the conductive structure;
• a guide structure over the substrate first side and comprising:
• a guide base;
• and
• guide rails coupled to the guide base and including a first guide rail comprising:
• a first outer portion that extends laterally outward from the electronic component lateral side;
• and
• a first inner portion that extends laterally underneath the electronic component;
• wherein:
• the conductive structure comprises inner terminals adjacent to the substrate first side and outer terminals adjacent to the substrate second side;
• and
• the guide structure is coupled to one or more of the outer terminals;
• an underfill interposed between the electronic component second side and the substrate first side, wherein the underfill is over the guide structure;
• and
• a cover over at least part of the electronic component and the substrate first side.

A method of forming an electronic device, comprising:

• providing a substrate comprising:
• a substrate first side;
• a substrate second side opposite to the substrate first side;
• and
• a conductive structure comprising internal terminals over the substrate first side;
• coupling an electronic component to the substrate, the electronic component comprising:
• an electronic component first side;
• an electronic component second side opposite to the electronic component first side;
• and
• an electronic component lateral side connecting the electronic component first side to the electronic component second side and defining an electronic component perimeter;
• wherein the electronic component second side is coupled to one or more of the internal terminals;
• providing a guide structure over the substrate first side and comprising:
• a first guide rail comprising:
• a first length;
• a first inner portion that is laterally inward from the electronic component lateral side;
• and
• a first outer portion that is laterally outward from the electronic component lateral side;
• a second guide rail laterally separated from the first guide rail and comprising:
• a second length;
• and
• a second outer portion that is laterally outward from the electronic component lateral side;
• and
• a guide base coupled to the first guide rail and the second guide rail;
• wherein:
• the electronic component comprises an electronic component length in a first direction generally perpendicular to the first guide rail;
• and
• the guide base comprises a guide base first length in the first direction and a guide base second length in a second direction generally parallel to the first guide rail;
• forming an underfill using the guide structure to guide the underfill extending underneath the electronic component;
• and
• providing a cover over at least part of the electronic component and the substrate first side.