Semiconductor package including lid structure with opening and recess

A semiconductor package structure, comprising:

• a package substrate having a first surface and a second surface opposite to the first surface;
• at least one semiconductor die on the first surface of the package substrate and surrounded by an encapsulating layer;
• a lid structure surrounding the encapsulating layer and capping a top surface of the semiconductor die, wherein the lid structure comprises a first opening that is covered by the first surface of the package substrate, wherein the first opening of the lid structure has a rectangular or circular shape as viewed from a top-view perspective, wherein the lid structure further comprises a second opening that is covered by the first surface of the package substrate, and wherein the second opening has an area that is different from that of the first opening as viewed from a top-view perspective;
• and
• a first electronic component over the first surface of the package substrate and arranged within the first opening of the lid structure.

A semiconductor package structure, comprising:

• a package substrate having a first surface and a second surface opposite to the first surface;
• at least one semiconductor die on the first surface of the package substrate and surrounded by an encapsulating layer;
• a lid structure surrounding and spaced apart from the encapsulating layer, wherein the lid structure comprises a first recess that is inwardly extended from an inner sidewall of the lid structure to form a first eave portion, wherein the first recess of the lid structure has a rectangular or circular shape as viewed from a top-view perspective, wherein the lid structure further comprises a second recess that is inwardly extended from the inner sidewall of the lid structure to form a second eave portion, and wherein the second recess has an area that is different from that of the first recess as viewed from a top-view perspective;
• and
• a first electronic component over the first surface of the package substrate and covered by the first eave portion of the lid structure.