Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
AssigneeKioxia Corporation
InventorJun Takagi
Life of this patent
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Abstract
In one embodiment, a semiconductor manufacturing apparatus includes a polisher configured to polish a film provided on a substrate. The apparatus further includes a thickness measurement module configured to measure a thickness of the film while the substrate is being conveyed before the polishing. The apparatus further includes a controller configured to control the polishing of the film by the polisher based on the thickness measured by the thickness measurement module.
Claims20
A semiconductor manufacturing apparatus comprising:
- a polisher configured to polish a film provided on a substrate;
- a thickness measurement module configured to measure a thickness of the film while the substrate is being conveyed before the polishing;
- and
- a controller configured to control the polishing of the film by the polisher based on the thickness measured by the thickness measurement module.
A method of manufacturing a semiconductor device, comprising:
- measuring a thickness of a film provided on a substrate by a thickness measurement module while the substrate is being conveyed before polishing by a polisher;
- polishing the film by the polisher;
- and
- controlling, by a controller, the polishing of the film by the polisher based on the thickness measured by the thickness measurement module.
A semiconductor manufacturing apparatus comprising:
- a processing module configured to process a film provided on a substrate;
- a thickness measurement module configured to measure a thickness of the film while the substrate is being conveyed before the processing;
- and
- a controller configured to control the processing of the film by the processing module based on the thickness measured by the thickness measurement module.
A method of manufacturing a semiconductor device, comprising:
- measuring a thickness of a film provided on a substrate by a thickness measurement module while the substrate is being conveyed before processing by a processing module;
- processing the film by the processing module;
- and
- controlling, by a controller, the processing of the film by the processing module based on the thickness measured by the thickness measurement module.
Dependencies are inferred from the claim text.