Production of very small or thin dies

An apparatus, comprising:

• an integrated circuit having Radio Frequency IDentification components and circuitry used for authentication, where the RFID components and circuitry are tuned to use two or more different resonant frequencies including 1) a first resonant RF used for power generation and 2) a second resonant RF used for data communication, where the integrated circuit contains a unique signature that is used for the authentication with two or more aspects including i) a first aspect that is a programmed password in a memory embedded on the integrated circuit, and ii) a second aspect that is a unique, randomly generated code based upon a physical characteristic of the integrated circuit, where the integrated circuit is contained on a die created with an ion etching process using an electrically-conductive-adhesive-composition located between a wafer and a porous substrate carrying the wafer during the ion etching process, where the electrically-conductive-adhesive-composition adheres the wafer to the porous substrate to keep the dies of the wafer in place during the ion etching process, where the electrically-conductive-adhesive-composition aids also aids in at least one of conducting electrons away from the wafer as a drain or conducting electrons into the wafer as a source of electrons during the ion etching process.