Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorsShota Umezaki, Hiroaki Inadomi
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Abstract
A substrate processing apparatus is configured to dry a substrate by replacing a liquid film formed on a top surface of the substrate, which is horizontally held, with a supercritical fluid. The substrate processing apparatus includes a pressure vessel, a cover body and a supporting body. The pressure vessel has therein a drying chamber for the substrate. The cover body is configured to close an opening of the drying chamber. The supporting body is configured to support the substrate horizontally within the drying chamber. The supporting body is fixed to the drying chamber.
Claims14
A substrate processing apparatus configured to dry a substrate by replacing a liquid film formed on a top surface of the substrate, which is horizontally held, with a supercritical fluid, the substrate processing apparatus comprising:
- a pressure vessel having therein a drying chamber for the substrate;
- a cover body configured to close an opening of the drying chamber;
- and
- a supporting body configured to support the substrate horizontally within the drying chamber,
- wherein the supporting body is fixed to the drying chamber, the supporting body comprises a rectifying plate configured to rectify a flow of the fluid in the drying chamber, and a placing member fixed to a top surface of the rectifying plate;
- wherein the rectifying plate is fixed to the drying chamber, and the substrate is placed on the placing member;
- and
- wherein the rectifying plate is formed to have a U-shape when viewed from the opening of the drying chamber, and comprises a horizontal plate placed on a lower wall of the pressure vessel and a pair of vertical plates respectively provided at both ends of the horizontal plate, and the vertical plates are fixed to a sidewall of the pressure vessel.
A substrate processing apparatus configured to dry a substrate by replacing a liquid film formed on a top surface of the substrate, which is horizontally held, with a supercritical fluid, the substrate processing apparatus comprising:
- a pressure vessel having therein a drying chamber for the substrate;
- a cover body configured to close an opening of the drying chamber, wherein the cover body is configured to be moved back and forth between a closing position where the cover body closes the opening and an opening position distanced apart from the closing position in a carry-out direction of the substrate;
- a supporting body configured to support the substrate horizontally within the drying chamber, wherein the supporting body is fixed to the drying chamber;
- a lock key configured to be fitted into an insertion hole of the pressure vessel to restrict the cover body from being retreated from the closing position toward the opening position;
- a film thickness gauge configured to measure a film thickness of the liquid film, wherein the film thickness gauge comprises a laser positioned in the insertion hole of the pressure vessel;
- an elevating mechanism configured to move the lock key up and down between a locking position where the lock key restricts the cover body from being retreated and a lock releasing position where the lock key allows the cover body to be retreated;
- and
- a rolling body configured to be rolled and mounted to the lock key,
- wherein the elevating mechanism has a horizontal surface on which the lock key is placed, and
- the rolling body includes multiple rolling bodies, and the multiple rolling bodies are provided at a bottom surface of the lock key to roll in contact with the horizontal surface of the elevating mechanism.
Dependencies are inferred from the claim text.