Electrostatic-chuck heater
AssigneeNGK Insulators, Ltd.
InventorsYutaka Unno, Reo Watanabe
Life of this patent
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Abstract
An electrostatic-chuck heater is of a Johnsen-Rahbek type and is used in a process of forming a conductive film on a wafer. The electrostatic-chuck heater includes a disc-shaped ceramic base including an electrostatic electrode and a heating resistor, and a hollow shaft attached to a side of the ceramic base that is opposite a side having a wafer-mounting surface. A through-hole extends in a peripheral wall of the hollow shaft from a lower end through to an area of the wafer-mounting surface that is on an inner side with respect to a circular groove. The through-hole allows gas to be supplied from the lower end of the hollow shaft into a below-wafer space enclosed by the wafer-mounting surface, an outermost projection group, and the wafer mounted on the wafer-mounting surface.
Claims7
A Johnsen-Rahbek electrostatic-chuck heater to be used in a process of forming a conductive film on a wafer, the electrostatic-chuck heater comprising:
- a disc-shaped ceramic base having on one side a wafer-mounting surface on which the wafer is to be mounted, the ceramic base including an electrostatic electrode and a heating resistor;
- a hollow shaft attached to a side of the ceramic base that is opposite the side having the wafer-mounting surface;
- an outermost projection group including a plurality of projections provided in an annular area of the wafer-mounting surface and arranged on a circle that is concentric with the ceramic base, the annular area having an outside diameter smaller than a diameter of the wafer;
- a circular groove provided on an inner side with respect to the outermost projection group;
- a plurality of through-holes extending in a peripheral wall of the hollow shaft from a lower end through to a central part of a circular-groove enclosed area of the wafer-mounting surface that is on an inner side with respect to the circular groove, each through-hole of the plurality of through-holes allowing gas to be supplied from the lower end of the hollow shaft into a below-wafer space enclosed by the wafer-mounting surface, the outermost projection group, and the wafer mounted on the wafer-mounting surface;
- a branch provided with each through-hole of the plurality of through-holes, extending from each of the respective through-holes in a radial direction inside the ceramic base;
- a circular hole provided inside the ceramic base concentrically with the ceramic base, communicating with the other end of the respective branch;
- and
- a vertical hole provided inside the ceramic base, arranged along the peripheral direction, communicating with the circular hole and opening in an outer peripheral part of the circular-groove-enclosed area that is on an inner side adjacent to the circular groove.
Dependencies are inferred from the claim text.