Multilayer ceramic capacitor having external electrodes provided with fluorine compound

A multilayer ceramic capacitor comprising:

• a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are stacked, a main component of the dielectric layers being ceramic, the multilayer chip having a rectangular parallelepiped shape, respective one ends of the plurality of internal electrode layers being exposed to at least one of a first end face and a second end face of the multilayer structure, the first end face being opposite to the second end face;
• a first external electrode provided on the first end face;
• a second external electrode provided on the second end face;
• and
• a fluorine compound that is adhered to surfaces of the first external electrode and the second external electrode, the fluorine compound being released at a temperature of 380 degrees C. or more, but not released at a temperature less than 380 degrees C.,
• wherein a thickness of the fluorine compound on the surfaces of the first external electrode and the second external electrode is 1 nm to 80 nm,
• wherein solely the fluorine compound is adhered, as a fluorine compound, to the surfaces of the first external electrode and the second external electrode.