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US 11,688,555 B2Granted
Chip electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorsYukihiro Fujita, Shogo Kanbe, Kosuke Nakano, Hideki Otsuka
Life of this patent
Estimating the term…
Abstract
A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.
Claims14
A chip electronic component comprising:
- a chip component body including a mounting surface facing a mounting board;
- at least two outer electrodes disposed on outer surfaces of the component body;
- and
- at least two spacers respectively electrically connected to the at least two outer electrodes and at least partially disposed along the mounting surface of the component body;
- wherein
- each of the at least two spacers have a predetermined thickness direction dimension on the mounting surface in a direction perpendicular or substantially perpendicular to the mounting surface;
- each of the at least two spacers contains an intermetallic compound containing at least one metal selected from Cu and Ni, and a simple Sn metal;
- the chip component body has a rectangular or substantially rectangular parallelepiped shape including first and second main surfaces that oppose each other, first and second side surfaces that oppose each other, and first and second end surfaces that oppose each other, the first and second side surfaces and the first and second end surfaces connecting the first and second main surfaces, and the mounting surface is defined by the second main surface;
- the at least two outer electrodes are respectively provided on the first and second end surfaces and respectively extend from the first and second end surfaces to portions of the first and second main surfaces and portions of the first and second side surfaces;
- each of the at least two spacers is disposed on the second main surface and includes a portion in contact with a corresponding one of the at least two outer electrodes and a portion in contact with the second main surface;
- and
- the at least two spacers are bonded to the mounting board by a bonding material.
9 more elements
A chip electronic component comprising:
- a chip component body including a mounting surface facing a mounting board;
- at least two outer electrodes disposed on outer surfaces of the component body;
- and
- at least two spacers respectively electrically connected to the at least two outer electrodes and at least partially disposed along the mounting surface of the component body;
- wherein
- each of the at least two spacers have a predetermined thickness direction dimension on the mounting surface in a direction perpendicular or substantially perpendicular to the mounting surface;
- each of the at least two spacers contains at least one metal selected from Cu and Ni, and a simple Sn metal;
- the chip component body has a rectangular or substantially rectangular parallelepiped shape including first and second main surfaces that oppose each other, first and second side surfaces that oppose each other, and first and second end surfaces that oppose each other, the first and second side surfaces and the first and second end surfaces connecting the first and second main surfaces, and the mounting surface is defined by the second main surface;
- the at least two outer electrodes are respectively provided on the first and second end surfaces and respectively extend from the first and second end surfaces to portions of the first and second main surfaces and portions of the first and second side surfaces;
- each of the at least two spacers is disposed on the second main surface and includes a portion in contact with a corresponding one of the at least two outer electrodes and a portion in contact with the second main surface;
- and
- the at least two spacers are bonded to the mounting board by a bonding material.
9 more elements
Dependencies are inferred from the claim text.